The Laser drilling is commonly used to drill the ceramic plates. With the help of our professional team, our minimum value of aperture can reach 0.06 mm and the minimum value of line width and distance can reach below 0.1 mm compared with the 0.15-0.5 mm aperture value of the industry. It doesn’t count too much, but our core technology is LAM, a rapid laser activation and metallization technology which can be applied in the making of the three-dimensional ceramic plate. It is difficult for the traditional PCB industry to produce 3D ceramic plates, because the traditional industry commonly adopts the graphic electroplating or straight etching to make the circuit, neither of which can be exposed and developed on the three-dimensional ceramic plate. However, our LAM technology can optionally plate the copper and make the circuit directly, which overcomes the problem that the circuit cannot be made on the three-dimensional ceramic plate.
Substrate type：aluminium nitride ceramics
Substrate material thickness：0.65mm
Conducting layer：Cu
Thickness of metal layer：75μm/75μm
Surface preparation：immersion gold
Metal single-sided / double sided：double sided
Copper plated through hole：yes
Solder mask：no
