Layer: 1 to 12 layers
Material: FR-4, CEM-1, CEM-3, Hight TG, FR4 halogen free, FR-1, FR-2
Max. finished thickness: 0.4 to 4.0mm
Max. finished board side: 500 x 500mm
Min. drilled hole size: 0.25mm (10mil)
Min. line width: 0.10mm (4mil)
Min. line spacing: 0.10mm (4mil)
Surface finish/treatment: HALS/HALS lead free, chemical tin, chemical gold, immersion gold, plating gold
Copper thickness: 0.5 to 3.0 oz
Solder mask color: green/black/white/red/blue
Inner packing: plastic bag
Outer packing: standard carton packing
Hole tolerance: PTH: ±0.076, NTPH: ±0.05
Certificate: UL, ISO 9001, ISO 14001, RoHS, H.S CODE: 8542900000
Profiling punching: routing, V-cut, beveling
Providing OEM service to all sorts of printed circuit board assembly
