MD300 diamond cutting wire for cutting silicon or sapphire cutting
Diamond cutting wire
Diamond cutting wire is a new products by our own research and development.
The quality has reached the world leading level. Products are used in manual, in-line, multi-wire cutting machines, it can replace the cutting process of light abrasive. For precise cutting various types of artificial crystal,
ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials and so on.
Also applies to laboratory or research institutes to conduct research.
Technical parameters:
1,Diameter: 0.12-0.34mm, diameter deviation ≤ 0.01mm
2,Cutting wire Material: imported high-quality and strength steel cutting wire
3,Diamond Grit: 5μm-60μm, we can design according to the customer's requirements
4,Tensile strength: 3200-3400Mpa
5,Wire length: we can made according to user's requirements
Features:
1,Saving material
Cutting crack is small and piece rate is high, saving material greatly.
2,Cutting precision
Cutting accuracy can be achieved, and surface is smooth, it can be polished directly after cutting, saving the grinding, time and material.
3,Cutting speed
Diamond cutting wire cutting speed is faster, greatly improving the work efficiency.
4,No edge breakage.
While cutting a variety of hard and brittle material, edge breakage are less than 10mm.
5,Reduce environmental pollution
Cutting and cooling by water, can prevent powder pollution and maintain environment of materials and equipment clean.
