General Information for High density pcb (HDI PCB)
HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB.
HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.
High Density PCB is used extensively in applications and industries including:
● Cell phone
● GPS
● Telecom
● ASemiconductor
● Automotive
● Military
● Medical
● Instrumentation
- 6L HDI printed circuit board for Intercom
6L High density PCB (HDI PCB) for intercom
Board dimensions: 110 x 166mm
Finished board thickness: 1.2mm
Material: FR-4 Tg150
Minimum holes size: 0.1mm
Minimum line width/clearance: 3.5/3.5mil
Copper thickness: 1oz
Solder mask: top and bottom (color: green)
Silkscreen: top (color: white)
Finish: immersion gold (top and bottom)
Board stack up: 1 + 4 + 1
- 6 Layers HDI PCB
6L High density PCB (HDI PCB) for intercom
Board dimensions: 80 x 120mm
Finished board thickness: 1.0mm
Material: FR-4 Tg150 halogen free
Minimum holes size: 0.1mm
Minimum line width/clearance: 2/3mil
Copper thickness: T oz (12um)
Solder mask: top and bottom (color: Blue)
Silkscreen: top (color: white)
Finish: immersion gold (top and bottom)
Board stack up: 1 + 4 + 1
- 8L Cell phone HDI board PCB
8layers High density PCB (HDI PCB) for cell phone
Base material: FR4, Tg150
Layer count: 8 layers (HDI PCB)
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.075mm
Minimum line spacing: 0.075mm
Laser drilling + blind and buried drilling Impedance control
Stack up: 1+6+1
- 10L High density printed circuit board
10layers HDI PCB
Base material: FR4, Tg170
Surface finishing: immersion gold
Board thickness: 1.0mm
Copper thickness: 0.5oz
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Laser drilling + blind and buried drilling Impedance control
Board stack up: 1+8+1
Impedance control
- 10L High Density Interconnect pcb
10L High Density Interconnect board
Laminate: FR4, Tg150
Board thickness: 1.6mm
Copper thickness: 17.5um (Hoz) for all layers
Solder resist: green color
Surface Finish: Immersion gold
Trace width/width: 0.89/0.1mm
Min. holes:0.1mm
Controlled Impedance
Board stack up: 1+1+6+1+1
Application: Industry control
- 10L stage 2 Automotive HDI PCB
Layer count: 2 stage 10 layer
Board thickness：1.0mm
Dimension：160*130mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.075mm
Minimum hole diameter：0.1mm
Surface finishing：immersion gold≥2u
