General Specification for HDI PCB
Layer Count: 4-20Layers
Type of stack up: 1+N+1, 2+N+2
Material Available: FR4, High Tg FR4, Halogen Free FR4
Board thickness: 0.4-3.2mm
Finished copper thickness: 1/3oz – 3oz
Min trace width/spacing: 3/3mil
Min through hole: 0.2mm
Min blind via: 0.1mm
Surface treatment: Immersion Gold, ENIG + OSP