14 PINS BUTTERFLY GLASS PACKAGE
Low temperature glass feed-through package is suitable for Butterfly Type Module, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc.
glass-to-metal sealed package
14 Pins Butterfly Package DIP
14 PINS BUTTERFLY CERAMIC PACKAGE
Multilayer ceramic package
Featured as high hermiticity and reliability, ceramic feed-through package is suitable for high power Butterfly Type Packed Module, SOA, Pump Laser Diode Module, Photodiode, Optic Telecommunication etc. It has better performance and more reliable than glass sealed package.
ceramic-to-metal sealed package
PERFORMANCE PARAMETERS:
Hermeticity: =1×10-3Pa.cm3/s(He)
Insulation Resistance: =1×1010O at 100V DC
Lead Resistance: =30 mO
Thickness of Ni /Au plated: 2µm /1.3µm
Standard: MIL-STD-883
MATERIALS
- CU-W BASE(WCU10/WCU15)
- KOVAR FRAME
- BLACK CERAMIC FEEDTHROUGH AL2O3
- KOVAR/ALLOY42 LEAD
- KOVAR SEAL RING
- KOVAR PIPE
Other type package housing can be customized. please send us your drawing for further discussion.
